반도체의 부가가치를 올리는 패키지와 테스트
서민석
한국과학기술원재료공학과에서학사,석사학위를취득하였고,반도체패키지를위한전해도금공정및재료연구로박사학위를취득하였다.이후SK하이닉스반도체에서SRAM&Flash공정개발에참여하였다가2003년부터반도체패키지개발부서에서RDL,FlipChip,FaninWLCSP,TSV(HBM,3DS,WideIO)등의WaferLevelPackage개발을주관하였다.
01반도체테스트의이해
01.？반도체후공정······················································5
02.？테스트의종류······················································8
03.？웨이퍼테스트····················································10
EPM································································13
웨이퍼번인·······················································13
테스트·····························································14
리페어······························································15
04.？패키지테스트····················································16
TDBI································································17
테스트·····························································18
외관검사··························································18
02반도체패키지의정의와역할
01.？반도체패키지의정의·········································25
02.？반도체패키지의역할········································26
03.？반도체패키지의개발트렌드·····························28
04.？반도체패키지개발과정···································31
03반도체패키지의종류
01.？반도체패키지의분류······················································39
02.？컨벤셔널패키지·······························································41
플라스틱패키지-리드프레임타입패키지··························41
플라스틱패키지-서브스트레이트타입패키지··················43
세라믹패키지································································46
03.？웨이퍼레벨패키지·························································47
웨이퍼레벨패키지·························································47
재배선···········································································56
플립칩··········································································58
04.？적층패키지·····································································66
패키지적층···································································67
칩적층-ChipStackwithWireBonding···························70
실리콘관통전극-ChipStackwithTSV···························73
05.？시스템인패키지·····························································86
04반도체패키지설계와해석
01.？반도체패키지설계·························································97
02.？구조해석·······································································101
휨해석········································································104
솔더접합부신뢰성·······················································106
강도해석·····································································108
03.？열해석··········································································109
04.？전기해석······································································113
05반도체패키지공정
01.？컨벤셔널패키지공정·······································123
백그라인딩····················································124
웨이퍼절단·····················································127
다이어태치····················································131
인터커넥션······················································137
몰딩·······························································143
마킹·······························································144
트리밍？리드프레임·········································146
솔더도금？리드프레임·····································147
성형？리드프레임············································147
솔더볼마운팅？서브스트레이트·······················148
싱귤레이션-서브스트레이트····························152
02.？웨이퍼레벨패키지공정··································153
포토공정·······················································156
스퍼터링공정·················································161
전해도금공정·················································163
습식공정？PR스트립과금속에칭····················166
팬인WLCSP공정············································167
솔더볼마운팅공정·········································168
플립칩범프공정············································169
재배선공정····················································171
팬아웃WLCSP공정·········································172
실리콘관통전극패키지공정····························174
03.？검사와측정······················································187
검사·······························································187
측정·······························································192
06반도체패키지재료
01.？컨벤셔널패키지재료····················································208
리드프레임··································································208
서브스트레이트····························································210
접착제·········································································217
에폭시몰딩컴파운드····················································222
솔더···········································································225
테이프·········································································228
와이어········································································229
포장재료····································································230
02.？웨이퍼레벨패키지재료···············································231
포토레지스트······························································231
도금용액·····································································234
PR스트립퍼·································································235
에천트·········································································237
스퍼터타깃·································································238
언더필·········································································238
캐리어와접착제,마운팅테이프······································240
07반도체패키지신뢰성
01.？신뢰성의미···································································247
02.？JEDEC기준···································································248
03.？수명신뢰성시험···························································253
EFR············································································253
HTOL·········································································254
LTOL··········································································255
HTSL··········································································256
LTSL···········································································257
Endurance·····················································257
DataRetention···············································258
04.？환경신뢰성시험··············································259
Preconditioning··············································259
TC·································································263
TS·································································268THS·······························································268PCTP······························································269
UHAST··························································270HAST·····························································271HALT·····························································272
05.？기계적신뢰성시험··········································273
충격································································274
진동·······························································275
구부림···························································275
비틀림·····························································276
08반도체용어해설？
용어해설··································································282