곽노열,배병욱,오경택외
저자:곽노열,배병욱,오경택,윤태균,이성희,임정훈,정용우,진수봉,최호승,홍기환
01반도체개요●반도체제조기술개요···················································501.반도체정의·····································································7●반도체란?···································································7●반도체의종류····························································802.반도체역사····································································9●트랜지스터·································································9●메모리····································································12●세계메모리반도체선도하는대한민국··························1503.미래메모리반도체························································17●메모리시장······························································17●기술적인한계···························································18●PCRAM제품·····························································20●ReRAM제품····························································25●STT-MRAM제품·······················································27●요약········································································3102DRAMMemory제품01.DRAMMemory소개·····················································37●DRAM이란?·····························································37●DRAM운용제품별특징·············································3902.DRAM기본동작소개····················································41●MOSFET··································································41●DRAMArchitecture··················································45●주요동작소개··························································48●SWD,S/A동작이해···················································52●REFRESH·······························································5503.DRAM주요ProcessModule·········································57●ISO/GATE·······························································57●SAC·········································································59●SN··········································································61●MLM·······································································6204.DRAM변화방향···························································64●DRAMMemory기술변화요구···································6403NANDMemory제품01.NANDFLASHMemory소개··········································73●FLASHMemory란?···················································73●FLASHMemoryMarketTrend····································7602.NANDFLASH기본동작소개·········································79●NANDArchitecture···················································79●Erase/Read/WriteOperation······································83●Cell의형태및String구조···········································93●ISPP········································································97●Cell분포및Multibitcell···········································9903.3DNAND구조소개····················································103●2DNAND와3DNAND············································103●PUC구조·······························································106●CTF·······································································107●Pipe와Pipeless······················································110●3DNANDProcessSequence····································11104.3DNANDKeyProcess···············································115●PLUG····································································115●ONOP···································································119●SLIM·····································································12105.FutureNANDFLASHMemory····································123●3DRe-NAND·························································123●3DFe-NAND·························································124●SGVC····································································12404Diffusion_Furnace공정01.Diffusion소개····························································131●Diffusion정의·························································132●Diffusion대표공정및소재소개································133●Diffusion대표장비소개···········································13702.Furnace공정이해·······················································142●Diffusion공정소개··················································142●Oxidation공정소개·················································142●LPCVD·······························································
