반도체 제조기술의 이해 2판 (양장)

반도체 제조기술의 이해 2판 (양장)

$67.74
Description
종합적인 반도체 제조업체에서는 이미 패키지와 테스트에 관련된 실무 전문성 있는 책자를 2020년에 발간한 바 있으며 본 책자는 그 후속편이라 할 수 있겠습니다.
이 책자가 반도체업에 종사하는 모든 분들께 도움이 될 것으로 생각하며 특히 메모리 반도체인 DRAM과 NAND의 기본적인 이해 및 FabFabrication,
반도체 공장의 제조공정과 각종 장비에 대한 궁금증 또는 필요성이 있는 직접 관련 업무의 종사자분들, 반도체 산업의 기반이라 할 수있는 재료, 부품, 장비업에 종사하시는 분들,
그리고 교육 현장에서 학생들을 가르치시는 선생님들과 미래의 반도체 세계최고 전문가를 꿈꾸는 대한민국의 많은 희망들께 도움이 될 것으로 기대합니다.
다만 한 가지 아쉬운 점은 산업 보안 등의 이유로 저자들이 담고자 했던 내용들을 온전히 담지 못한것이며, 이에 대해서는 독자 여러분들의 넓은 이해를 구하고자 합니다.
저자

곽노열,배병욱,오경택외

저자:곽노열,배병욱,오경택,윤태균,이성희,임정훈,정용우,진수봉,최호승,홍기환

목차

01반도체개요

●반도체제조기술개요···················································5



01.반도체정의·····································································7

●반도체란?···································································7

●반도체의종류····························································8



02.반도체역사····································································9

●트랜지스터·································································9

●메모리····································································12

●세계메모리반도체선도하는대한민국··························15



03.미래메모리반도체························································17

●메모리시장······························································17

●기술적인한계···························································18

●PCRAM제품·····························································20

●ReRAM제품····························································25

●STT-MRAM제품·······················································27

●요약········································································31





02DRAMMemory제품

01.DRAMMemory소개·····················································37

●DRAM이란?·····························································37

●DRAM운용제품별특징·············································39



02.DRAM기본동작소개····················································41

●MOSFET··································································41

●DRAMArchitecture··················································45

●주요동작소개··························································48

●SWD,S/A동작이해···················································52

●REFRESH·······························································55



03.DRAM주요ProcessModule·········································57

●ISO/GATE·······························································57

●SAC·········································································59

●SN··········································································61

●MLM·······································································62



04.DRAM변화방향···························································64

●DRAMMemory기술변화요구···································64





03NANDMemory제품

01.NANDFLASHMemory소개··········································73

●FLASHMemory란?···················································73

●FLASHMemoryMarketTrend····································76



02.NANDFLASH기본동작소개·········································79

●NANDArchitecture···················································79

●Erase/Read/WriteOperation······································83

●Cell의형태및String구조···········································93

●ISPP········································································97

●Cell분포및Multibitcell···········································99



03.3DNAND구조소개····················································103

●2DNAND와3DNAND············································103

●PUC구조·······························································106

●CTF·······································································107

●Pipe와Pipeless······················································110

●3DNANDProcessSequence····································111



04.3DNANDKeyProcess···············································115

●PLUG····································································115

●ONOP···································································119

●SLIM·····································································121



05.FutureNANDFLASHMemory····································123

●3DRe-NAND·························································123

●3DFe-NAND·························································124

●SGVC····································································124





04Diffusion_Furnace공정

01.Diffusion소개····························································131

●Diffusion정의·························································132

●Diffusion대표공정및소재소개································133

●Diffusion대표장비소개···········································137



02.Furnace공정이해·······················································142

●Diffusion공정소개··················································142

●Oxidation공정소개·················································142

●LPCVD·······························································