반도체 제조기술의 이해 (2 판 | 양장본 Hardcover)

반도체 제조기술의 이해 (2 판 | 양장본 Hardcover)

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Description
종합적인 반도체 제조업체에서는 이미 패키지와 테스트에 관련된 실무 전문성 있는 책자를 2020년에 발간한 바 있으며 본 책자는 그 후속편이라 할 수 있겠습니다.
이 책자가 반도체업에 종사하는 모든 분들께 도움이 될 것으로 생각하며 특히 메모리 반도체인 DRAM과 NAND의 기본적인 이해 및 FabFabrication,
반도체 공장의 제조공정과 각종 장비에 대한 궁금증 또는 필요성이 있는 직접 관련 업무의 종사자분들, 반도체 산업의 기반이라 할 수있는 재료, 부품, 장비업에 종사하시는 분들,
그리고 교육 현장에서 학생들을 가르치시는 선생님들과 미래의 반도체 세계최고 전문가를 꿈꾸는 대한민국의 많은 희망들께 도움이 될 것으로 기대합니다.
다만 한 가지 아쉬운 점은 산업 보안 등의 이유로 저자들이 담고자 했던 내용들을 온전히 담지 못한것이며, 이에 대해서는 독자 여러분들의 넓은 이해를 구하고자 합니다.
저자

곽노열

출간한대표작으로는[반도체제조기술의이해]가있다.

목차

01반도체개요
●반도체제조기술개요···················································5
01.반도체정의·····································································7
●반도체란?···································································7
●반도체의종류····························································8
02.반도체역사····································································9
●트랜지스터·································································9
●메모리····································································12
●세계메모리반도체선도하는대한민국··························15
03.미래메모리반도체························································17
●메모리시장······························································17
●기술적인한계···························································18
●PCRAM제품·····························································20
●ReRAM제품····························································25
●STT-MRAM제품·······················································27
●요약········································································31

02DRAMMemory제품
01.DRAMMemory소개·····················································37
●DRAM이란?·····························································37
●DRAM운용제품별특징·············································39
02.DRAM기본동작소개····················································41
●MOSFET··································································41
●DRAMArchitecture··················································45
●주요동작소개··························································48
●SWD,S/A동작이해···················································52
●REFRESH·······························································55
03.DRAM주요ProcessModule·········································57
●ISO/GATE·······························································57
●SAC·········································································59
●SN··········································································61
●MLM·······································································62
04.DRAM변화방향···························································64
●DRAMMemory기술변화요구···································64

03NANDMemory제품
01.NANDFLASHMemory소개··········································73
●FLASHMemory란?···················································73
●FLASHMemoryMarketTrend····································76
02.NANDFLASH기본동작소개·········································79
●NANDArchitecture···················································79
●Erase/Read/WriteOperation······································83
●Cell의형태및String구조···········································93
●ISPP········································································97
●Cell분포및Multibitcell···········································99
03.3DNAND구조소개····················································103
●2DNAND와3DNAND············································103
●PUC구조·······························································106
●CTF·······································································107
●Pipe와Pipeless······················································110
●3DNANDProcessSequence····································111
04.3DNANDKeyProcess···············································115
●PLUG····································································115
●ONOP···································································119
●SLIM·····································································121
05.FutureNANDFLASHMemory····································123
●3DRe-NAND·························································123
●3DFe-NAND·························································124
●SGVC····································································124

04Diffusion_Furnace공정
01.Diffusion소개····························································131
●Diffusion정의·························································132
●Diffusion대표공정및소재소개································133
●Diffusion대표장비소개···········································137
02.Furnace공정이해·······················································142
●Diffusion공정소개··················································142
●Oxidation공정소개·················································142
●LPCVD··································································149
●ALD공정································································160
03.Furnace장비의이해···················································170
●Furnace장비소개···················································170
●Batch장비·····························································171
●Chamber장비소개·················································179
04.공정과장비관리